Student Professional Awareness Conference
(SPAC) 2014

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The University of Washington HKN/IEEE student branch will be hosting the annual Student Professional Awareness Conference (SPAC) on Wednesday, April 9th! This event provides companies with an opportunity to network with a variety of electrical engineering students while enjoying a catered dinner.

Students: While here, you will get a chance to receive insider knowledge about the job application process, the state of the industry and a chance to improve your personal networking and communication skills. In addition, there will be free prizes.

Business casual attire recommended.


Date: Wednesday, April 9, 2014
Time: 5:00 - 8:00pm
Location: Kane Hall, Walker-Ames Room

Employer Registration

CLICK HERE to register for the SPAC 2014 as an employer.

Student Registration

Complete the following steps to register for SPAC 2014:

  1. CLICK HERE to register for SPAC 2014 as a student.
  2. Registration is only $5 per student. Click the “Pay Now” button below to complete your registration
  3. Print and bring your PayPal payment confirmation and student ID as your entry ticket to SPAC 2014. (Can be printed immediately after PayPal payment or printed from the confirmation email sent to the email address you provide to PayPal.)


Volunteers are needed for SPAC 2014! The volunteers get free registration for the event, and the opportunity to communicate with industry reps ahead of time. Plus, it will be a great experience helping set up a major professional event! We are also looking for leadership positions for next year too! Please email Kaiwei Zhang( for more details if you are interested!

Student Feedback

“Last year I had the opportunity to attend UW IEEE’s SPAC. The keynote speech delivered by the former IEEE president conveyed vital tools and advice for any engineer going on to grad school or industry.” -Joe M.

“Last year’s IEEE SPAC was AWESOME! I had the opportunity to network and learn about the hiring process’ of Fortune 500 companies like T-Mobile, Boeing, Intel, and more.” -Marcus B., RM&S Engineer - United Technologies